High temperature diffusion bonding for sintered alumina. 2nd report. Evaluation of bonding strength and microstructure.
نویسندگان
چکیده
منابع مشابه
Effect of diffusion bonding temperature on microstructure properties of Zr/Ti interlayer in the diffusion bonded joints of Zr702 to A516 steel
In this study, the effect of temperature on the microstructure and reactive layer at the interface between the Ti interlayer and the base metal related to the diffusion bonding of Zr702 to A516 low alloy steel was investigated. The joining was done using the spark plasma sintering technique at temperatures of 900, 950 and 1000°C for 30 minutes. Field Emission Scanning Electron Microscope (FESEM...
متن کاملبررسی خواص مکانیکی و ریز ساختاری اتصال نفوذی TLP نانوکامپوزیت Al2O3p/Alبا استفاده از لایه واسطه مس
Due to their superior properties such as high specific strength, high creep resistance and high strength at elevated temperatures, aluminum composites reinforced with alumina nano particles are widely used for advanced purposes such as aerospace and auto industries. Lack of an appropriate welding process limits their applications. Transient liquid phase (TLP) bonding is one of the state-of-the...
متن کاملEffect of diffusion bonding temperature on microstructure properties of Zr/Ti interlayer in the diffusion bonded joints of Zr702 to A516 steel
In this study, the effect of temperature on the microstructure and reactive layer at the interface between the Ti interlayer and the base metal related to the diffusion bonding of Zr702 to A516 low alloy steel was investigated. The joining was done using the spark plasma sintering technique at temperatures of 900, 950 and 1000°C for 30 minutes. Field Emission Scanning Electron Microscope (FESEM...
متن کاملMicrostructure and mechanical properties of pressureless sintered alumina-silver composites
The silver toughened alumina ceramics, which were fabricated via a conventional ceramic processing route using commercially available alumina and silver oxide powders as the starting materials, exhibit a higher fracture toughness (6 to 9 MPamo.5) than the monolithic alumina ceramic ( 2.5 to 3.0 MPamo.5). The weak interfacial bonding between the silver inclusions and the alumina matrix is charac...
متن کاملWafer-to-Wafer Bonding for Microstructure Formation
Wafer-to-wafer bonding processes for microstructure fabrication are categorized and described. These processes have an impact in packaging and structure design. Processes are categorized into direct bonds, anodic bonds, and bonds with intermediate layers. Representative devices using wafer-to-wafer bonding are presented. Processes and methods for characterization of a range of bonding methods a...
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ژورنال
عنوان ژورنال: Journal of the Japan Society of Powder and Powder Metallurgy
سال: 1985
ISSN: 0532-8799,1880-9014
DOI: 10.2497/jjspm.32.90